The 2019 Electronic Design Process Symposium will be a leading forum for advanced chip and systems design pocesses development and CAD methodologies.
Recent advances in computational power, data science technology, and associated applications have led to the development and proliferation of machine learning, intelligent manufacturing, and predictive design methodologies. New techniques are also emerging to enable reduced NRE and faster time to market, which are critical components in any semiconductor business.
CALL FOR PAPERS:
In this annual gathering of electronic IC/system designers, developers, and manufacturing experts, we will discuss design methodologies, design flows and CAD tool needs via keynotes, presentations, and panel discussions.
Contributors may choose from topics such as:
Machine Learning in System Design and EDA
Innovative Designs and Design Techniques
Cyber Systems Design with emphasis on security
Please contact, contact Ray Rodriguez (email@example.com) to submit IEEE-EDPS 2019 abstract and discuss mutual areas of interest.
All presentations slides will need to be available in final form by Aug 15, 2019.
For More information: http://edpsieee.ieeesiliconvalley.org/index.php