"NAND Flash Product (Test) Engineer *Expected onboarding date: 2019/Q2"
May 7, 2019 華邦電子 Winbond Electronics Corp.,   Hsinchu, Taiwan

Responsibilities:
With NAND Flash product engineering experience (at least 1 generation PE experience for process development), and 10+ year of product engineering career with strong hands-on bench testing.

Requirements:
1. 10+ year of product engineering career with strong hands-on bench testing
2. Work experience in Toshiba, San Disk, Samsung, Hynix preferred.
3. Prefer to be willing to work in Taiwan; this is negotiable for outstanding candidates. 

Corporate Website: http://www.winbond.com.tw/hq/?__locale=en
For submitting the resume, please send it to: tiff_liang@itri.org.tw;a989102@itri.org.tw;serena_lee@itri.org.tw.