NAND Flash Product (Test) Engineer *Expected onboarding date: 2019/Q4
Jul 10, 2019 華邦電子 Winbond Electronics Corp., Hsinchu, Taiwan
With NAND Flash product engineering experience (at least 1 generation PE experience for process development), and 10+ year of product engineering career with strong hands-on bench testing.
1. 10+ year of product engineering career with strong hands-on bench testing
2. Work experience in Toshiba, San Disk, Samsung, Hynix preferred.
3. Prefer to be willing to work in Taiwan; this is negotiable for outstanding candidates.
4. Expected onboarding date: 2019/Q4
Corporate Website: http://www.winbond.com.tw/hq/?__locale=en
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