NAND Flash Process Integration Engineer
Jul 10, 2019 華邦電子 Winbond Electronics Corp.,   Taichung, Taiwan

Responsibilities:
NAND Flash technology development

Requirements:
1. With NAND Flash 20nm or 1Xnm process development experience, and at least 10-year of process technology development experiences (or yield enhancement experience)
2. With strong hands-on experience in silicon fabrication processes and integration: lithography, etching, diffusion, thin films deposition. 
3. Expected onboarding date: as soon as possible

Corporate Website: http://www.winbond.com.tw/hq/?__locale=en
For submitting the resume, please send it to: tiff_liang@itri.org.tw;a989102@itri.org.tw;serena_lee@itri.org.tw.