NAND Flash Process Integration Engineer
Jul 10, 2019 華邦電子 Winbond Electronics Corp.,   Taichung, Taiwan

NAND Flash technology development

1. With NAND Flash 20nm or 1Xnm process development experience, and at least 10-year of process technology development experiences (or yield enhancement experience)
2. With strong hands-on experience in silicon fabrication processes and integration: lithography, etching, diffusion, thin films deposition. 
3. Expected onboarding date: as soon as possible

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