NAND Flash Process Integration Engineer
Jul 10, 2019 華邦電子 Winbond Electronics Corp., Taichung, Taiwan
NAND Flash technology development
1. With NAND Flash 20nm or 1Xnm process development experience, and at least 10-year of process technology development experiences (or yield enhancement experience)
2. With strong hands-on experience in silicon fabrication processes and integration: lithography, etching, diffusion, thin films deposition.
3. Expected onboarding date: as soon as possible
Corporate Website: http://www.winbond.com.tw/hq/?__locale=en
For submitting the resume, please send it to: firstname.lastname@example.org;email@example.com;firstname.lastname@example.org.