NAND Flash Process Module Engineer
Jul 10, 2019 華邦電子 Winbond Electronics Corp.,   Taichung, Taiwan

Responsibilities:
NAND Flash technology development
1. Hot Process (Furnace & RTP), LPCVD, ALD, Wet for advance NOR, 2xnm beyond NAND flash development. 
2. NAND Flash W gate & Air-Gap development.
3. The research experience of CoSi/NiSi material.
4. CVD gap fill and step coverage process control.
5. RRAM TMO new material development.

Requirements:
1. With NAND Flash 20nm or 1Xnm process development experience, and at least 10-year of module process development experiences.
2. With strong hands-on experience in silicon fabrication processes: etching or diffusion.

Corporate Website: http://www.winbond.com.tw/hq/?__locale=en
For submitting the resume, please send it to: tiff_liang@itri.org.tw;a989102@itri.org.tw;serena_lee@itri.org.tw