DRAM Product (Test) Engineer
Jul 10, 2019 華邦電子 Winbond Electronics Corp.,   Hsinchu, Taiwan

Responsibilities:
Evaluation, validation, probe test, yield/quality improvement or failure analysis of DRAMs

Requirements:
1. Evaluation, validation, probe test, yield/quality improvement or failure analysis of DRAM(DDR3, DDR4, DDR5, LPDDRs) above 5 years’ experience.
2. With DRAM new technology development experience; Experience in DRAM product engineering, DRAM wafer testing engineering, or DRAM product Testing. 
3. Familiar with Advantest, MOSAID.

Corporate Website: http://www.winbond.com.tw/hq/?__locale=en
For submitting the resume, please send it to: tiff_liang@itri.org.tw;a989102@itri.org.tw;serena_lee@itri.org.tw