ASE (U.S.) INC.
Job Title: Sr. Application Engineer
FLSA Status: Exempt
Prepared By: Cindy Diola
SUMMARY: As a Sr. Application Engineer, you will support the Vice President and/or Director of Engineering in promoting ASE technology, working with ASE customer to support new product introduction and working with ASE factory engineering teams to maintain production yield, solving field related application issues. Working with customer to understand and support their product roadmap requirements, maintain ASE leadership position in the semiconductor market.
ESSENTIAL DUTIES AND RESPONSIBILITIES include the following, other duties may be assigned:
• Review customers’ device and feedback to engineering team for IC packages developing to meet specific applications needs.
• Co-work with manufacturing team from new designs into volume productions.
• Work closely with R&D group to develop an advanced package for high speed /high performance applications
• Understand IC package thermal electrical & stress characterization & modeling
• Collect technical & marketing information for process engineering & R&D group to develop advanced packages.
• Follow up engineering issues with customers and manufacturing team
Work with ASE's U.S. sales teams, customers and Taiwan factory to evaluate customer’s IC package characteristics (design rules) to perform IC packaging substrate feasibility study and design layout, and to develop a thorough understanding of customer’s technical requirements, as well as their roadmaps for future products and technology requirements. Work with ASE sales team to help customer in high-speed IC packaging design by utilizing ASE's latest IC packaging design rules and manufacturing processes. Provide engineering support to sales team and customer to archive optimal IC packaging solution in terms of manufacturing cycle time, electrical/thermal performance, low cost and time-to-market. Work with sales team and customer on design changes to resolve design issues and ensure customer’s design meets ASE’s assembly flow and procedures. Perform other related job duties as assigned.
EDUCATION and/or EXPERIENCE: ASE requires a BS degree in engineering or related fields experience with 8+ years of experience in IC packaging and IC assembly. A strong understanding with 5+ years of experience on IC packaging design rule and IC assembly process. Must be familiar with IC assembly quality control flow and QA process. Fluency in English and good communication skills are required, fluency in Mandarin is a plus.
SUPERVISORY RESPONSIBILITIES: No supervisor responsibility, but must be able to organize and work with cross functional team inside ASE, and with customer to accomplish the program objective.
COMMUNICATION SKILLS: Must have excellent written and oral communication skills. Fluent in English and good communication skills are required, fluency in Mandarin is a plus.
COMPUTER/SOFTWARE SKILLS/KNOWLEDGE: Proficient in Word, Excel and Power Point. MS Outlook, Cadence package design, layout tool experience, are a plus.
QUALIFICATIONS: To perform this job successfully, an individual must be able to perform each essential duty satisfactorily and must be flexible. The requirements listed above are representative of the knowledge, skill, and/or ability required. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.
REASONING ABILITY: Work independently and have ability to make decisions.
PHYSICAL DEMANDS: The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.
WORK ENVIRONMENT: The work environment characteristics described here are representative of those an employee encounters while performing the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.
Applicant can directly submit resume to: firstname.lastname@example.org