Sr. RF Application Engineer
Dec 23, 2019 ASE (U.S.) INC.,   Sunnyvale, CA


Job Description

Title: Sr. RF Application Engineer

System Group, ASE (US) Inc



This position is Field Application Engineer supporting customer on Radio Frequency (RF) product development, including WiFi/BT/UWB/5G/ etc, by owning program management on IC packaging, Module/PCB design, RF tuning, assembly and test.  The person needs knowledge in semiconductor IC packaging technology, substrate design, process, test and failure analysis. RF IC/package product experience, hardware design, component selection, tuning and test is plus. Work directly with IC and OEM customer.


ESSENTIAL DUTIES AND RESPONSIBILITIES include the following, other duties may be assigned:

-Front line interface with customer on technical inquiry

-Support technical discussion on module design (schematic and layout), component selection, RF tuning analysis, test report, and yield analysis

-Research and analyze a wide range of in-depth technical questions related to integration of RF in module solutions

-RF system analysis capability

-Oversees complete new product introduction from design, simulation, RF tuning, assembly process, tooling/equipment, manufacturability, qualification and test

-Project management on development schedule, support customer sample build request in each phase 

-Drive NPI process yield improvement, reliability and quality. Drive internal technology roadmap to meet customer future requirement

-Collaborate with supply chain partner on quality issues from component, IC, package, module and PCB

-Support business development with sales team, including new product engagement and coordinate technology promotion.

-Support NPI to MP ramp transition, and major field issues including yield and quality crisis and customer RMA. 


Supervisory Roles:No supervisory role needed


EDUCATION and/or EXPERIENCE:  MS in electrical engineering, minimum 5 years’ experience in electronic industry, or BSEE with min 8 years experience. Prior knowledge in RF product development, IC package, Module and PCB manufacturing. Good interpersonal skills. Excellent in written English and verbal communication.  Bilingual in Chinese and English is a plus.


COMPUTER/SOFTWARE SKILLS/KNOWLEDGE:  Proficient in MS Office, AutoCAD viewer, Cadence package design, layout tool experience are a plus. 

Applicant can directly submit resume to: