Last week, I attended the 25th TSMC North American Technology Symposium. It is a great venue to see old friends and former coworkers, as well as getting updates on technology.
On the process node, TSMC continues to follow Moore’s law and break the industry's records every year such as 16FF+ (16nm FinFET plus) in 2015, 16FFC in 2016, N10 in 2017, N7 in 2018, and N5 in 2019.
At this moment, TSMC’s Industry first 7nm EUV process is in volume production, and the most advanced 5nm process is in risk production.
On the emerging memory, the foundry has its 22nm embedded MRAM qualified. This progress opens the door for new AI chip architecture and new applications.
Congratulations to TSMC for its leading technology achievement!
President and Chairman, CASPA
Soft Skill seminar: Top Traps in Communication and Smart Solutions
Date: Tuesday, May. 7, 2019
Time: 6:30pm – 8:30pm
Venue: ITRI International Inc., 2870 Zanker Rd #140, San Jose, CA 95134
6:30pm - 7:00pm: registration
7:00pm - 7:10pm: CASPA intro and ITRI welcome remarks
7:10pm - 8:00pm: seminar
Speaker I: Top Traps in Communication and Smart Solutions
Speaker II: Professor Kruze will share stories on communication, with a slight focus on China relationship in a historical context
8:00pm - 9:00pm: Q&A, discussion
Online registration: Soft Skill seminar: Top Traps in Communication and Smart Solutions
Time: 5/2/2019 (Thr.)
Venue: Santa Clara Convention Center 5001 Great America Pkwy Santa Clara, CA
CASPA Job Alert
Specials for CASPA Members and Sponsors
- [Chef Zhao Bistro] Best Sichuan Restaurant, vote by Chihuo Dine In, Lunch or Dinner to Go, Bento Box, Party Trays, Catering CASPA members & CASPA Corporate Sponsors Special: 10% off Bento Box, 20% off Party Trays & Catering Services for orders over $200
Summary of Past CASPA Major Events
The following links include presentation materials and/or summary for previous major CASPA events in the recent year:
Thank you for your kind attention and generous support. We look forward to seeing you at CASPA events.
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