CASPA eLetter: No. 164, June 15, 2019
Jun 15, 2019

President's Words

Dear Members,

The M&A announcements that swept the semiconductor industry was at its high in 2015 and 2016. It slowed down in 2017, and then further eased in 2018. In the first half of 2019, we continue to see this momentum. There have been two cases this month. On June 2, Germany's Infineon announced the acquisition of Cypress for $10.1 billion. Infineon's goal is to seize the eighth place in the industry and enter the Internet of Things. The other case occurred on June 10 when Intel announced the acquisition of Barefoot Networks to accelerate the delivery of Ethernet-based configurable switching chips.

On the other hand, CASPA's symposium team is working hard to bring Summer symposium for you. The agenda has been posted. Please see the details below. We will host the event on Saturday; it is in the same week as Semicon West to promote participation. I sincerely hope to see you all on July 13.


Daniel Hua

President and Chairman, CASPA

CASPA Events

CASPA Summer Symposium

Date: Saturday, Jul. 13, 2019
Time: 12:00pm – 5:10pm
Venue: SEMI Milpitas, 673 S Milpitas Blvd, Milpitas, CA 95035
Attire: Business Casual
Topic: Breaking the Memory Wall, the AI Bottleneck

12:00pm – 1:00pm Registration & Networking
1:00 pm – 1:10pm Welcome from Semi & CASPA chairman
1:10 pm – 1:40pm Ajit Manocha, CEO, SEMI
1:40 pm – 2:10pm Steven Woo, Fellow and Distinguished Inventor, Rambus
2:10 pm – 2:20pm Break
2:50 pm – 3:20pm Naveed Sherwani, President and CEO, SiFive
3:50 pm – 4:00pm Break
4:00 pm – 5:00pm Panel Session : Breaking the Memory Wall, the AI Bottleneck
                                Lung Chu, President, SEMI China (Moderator)
                                Nilesh Gharia, CTO, Numem
                                Robert Fan, President, SiliconMotion USA
5:00 pm – 5:10pm Closing Remark

The theme of the symposium is “Breaking Memory Wall, the AI bottleneck”, it covers challenges in Artificial Intelligence, how to overcome and the impact in the future of semiconductor industry. The symposium will enhance participating company’s leadership for the revolution happening in our industry around semiconductor and AI.

Online registration: CASPA Summer Symposium

CASPA Autumn Delegation Trip to Taiwan

Date: Sep. 18, 2019 - Sep. 20, 2019

Recruit high tech startups to join 2019 CASPA international Taiwan delegation trip; get the first hand information of Taiwan market, network with high profile VC’s and industry leaders, present your projects in high tech summit, and meet local governmental decision makers. Selected startups will have incentives. Email to get registration details and fee information.

Please provide following information:

name/contact, cell phone/email/company, name/presented, project name/bio/projects, introduction (500 words)
(1. core technology; 2 projected revenue; 3. land/facility/fund requirements 4. require roadshow)

Alliance Events

Date: 7/9/2019 - 7/11/2019
Time: 8:30am – 4:00pm

Venue: SEMICON West @ Moscone Convention Center, 747 Howard Street, San Francisco

CASPA Job Alert

Specials for CASPA Members and Sponsors

  • [Chef Zhao Bistro] Best Sichuan Restaurant, vote by Chihuo Dine In, Lunch or Dinner to Go, Bento Box, Party Trays, Catering CASPA members & CASPA Corporate Sponsors Special: 10% off Bento Box, 20% off Party Trays & Catering Services for orders over $200
  • [Air China] Special discount code for CASPA members and sponsors: USSME19006. Please follow the instructions below to purchase tickets online with the discount code.

Summary of Past CASPA Major Events

The following links include presentation materials and/or summary for previous major CASPA events in the recent year:

Thank you for your kind attention and generous support. We look forward to seeing you at CASPA events.


CASPA | eLetter Publication

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