CASPA eLetter: No. 165, June 30, 2019
Jun 30, 2019

President's Words

Dear Members,

I recently attended the Conference on Computer Vision and Pattern Recognition (CVPR 2019) and the International Symposium on Computer Architecture (ISCA 2019).

In CVPR, this year's record-breaking number exceeded 9,000 participants, and the number of papers received also exploded in exponential form, reaching 5,160. More than half (56%) of the papers submitted were from Asia, and only 25% of them were selected. I also saw a lot of papers on precise segmentation and adverse attack detection. Artificial intelligence will undoubtedly continue to be a paradise for technology hotspots and job markets.

At ISCA, the main papers come from academia. This year's AI-related accelerators and side channel security are the two main focuses. This year's Turing Lecture was delivered by Geoffrey Hinton and Yann LeCun. Their 30 years of dedication and persistence have experienced two long winters of artificial intelligence until the breakthrough of the back propagation algorithm. During that time, they also experienced the rejection of key papers algorithm. Their stories are very inspiring. If you are interested in watching the lecture, please visit the following link: https://youtu.be/VsnQf7exv5I

Returning to the CASPA conference, we will discuss the latest semiconductor market trends and memory wall issues in AI data computations for the CASPA's signature Summer Symposium on July 13. Please register now to secure your seat. We are looking forward to meeting you.

Regards,

Daniel Hua

Chairman and President, CASPA

CASPA Events

CASPA Summer Symposium

flyer_9_30_2018

Date: Saturday, Jul. 13, 2019
Time: 12:00pm – 5:10pm
Venue: SEMI Milpitas, 673 S Milpitas Blvd, Milpitas, CA 95035
Attire: Business Casual
Topic: Breaking the Memory Wall, the AI Bottleneck

Agenda:
12:00pm – 1:00pm Registration & Networking
1:00 pm – 1:10pm Welcome from Semi & CASPA chairman
1:10 pm – 1:40pm Ajit Manocha, CEO, SEMI
                                "Semiconductor Market Trends in the Digital Era"

1:40 pm – 2:10pm Steven Woo, Fellow and Distinguished Inventor, Rambus
                                "Breaking Down the AI Memory Wall"

2:10 pm – 2:20pm Break
2:20 pm – 2:50pm Sayeef Salahuddin, Professor of EECS Dept., UC Berkeley
                                "Negative Capacitance Transistors"

2:50 pm – 3:20pm Naveed Sherwani, President and CEO, SiFive
                                "Domain Specific Architectures Accelerating Embedded AI for Edge Devices"

3:20 pm – 3:50pm Bill En, Sr. Director, AMD
                                "Advanced Computing and Memory Innovation for AI"

3:50 pm – 4:00pm Break
4:00 pm – 5:00pm Panel Session : Breaking the Memory Wall, the AI Bottleneck
                                Lung Chu, President, SEMI China (Moderator)
                                Nilesh Gharia, CTO, Numem
                                Robert Fan, President, SiliconMotion USA
                                Ray Cisneros, VP, Algolux
                                Eugene Feng, Director, Micron
5:00 pm – 5:10pm Closing Remark
                                Lung Chu, President, SEMI China (Moderator)
Abstract:
The theme of the symposium is “Breaking Memory Wall, the AI bottleneck”, it covers challenges in Artificial Intelligence, how to overcome and the impact in the future of semiconductor industry. The symposium will enhance participating company’s leadership for the revolution happening in our industry around semiconductor and AI.

Online registration: CASPA Summer Symposium


CASPA Autumn Delegation Trip to Taiwan


Date: Sep. 18, 2019 - Sep. 20, 2019

Recruit high tech startups to join 2019 CASPA international Taiwan delegation trip; get the first hand information of Taiwan market, network with high profile VC’s and industry leaders, present your projects in high tech summit, and meet local governmental decision makers. Selected startups will have incentives. Email jwang882001@yahoo.com to get registration details and fee information.

Please provide following information:

name/contact, cell phone/email/company, name/presented, project name/bio/projects, introduction (500 words)
(1. core technology; 2 projected revenue; 3. land/facility/fund requirements 4. require roadshow)

Alliance Events

Date: 7/9/2019 - 7/11/2019
Time: 8:30am – 4:00pm

Venue: SEMICON West @ Moscone Convention Center, 747 Howard Street, San Francisco

Date: 7/9/2019 - 7/11/2019

Venue: SEMICON West @ Moscone Convention Center, 747 Howard Street, San Francisco

CASPA Job Alert

Specials for CASPA Members and Sponsors

  • [Chef Zhao Bistro] Best Sichuan Restaurant, vote by Chihuo Dine In, Lunch or Dinner to Go, Bento Box, Party Trays, Catering CASPA members & CASPA Corporate Sponsors Special: 10% off Bento Box, 20% off Party Trays & Catering Services for orders over $200
  • [Air China] Special discount code for CASPA members and sponsors: USSME19006. Please follow the instructions below to purchase tickets online with the discount code.

Summary of Past CASPA Major Events

The following links include presentation materials and/or summary for previous major CASPA events in the recent year:

Thank you for your kind attention and generous support. We look forward to seeing you at CASPA events.


Sincerely,

CASPA | eLetter Publication


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