CASPA 2019 Student Scholarship
August 15th, 2019 - CASPA announced today accepting applications for 2019 Student Scholarship from high school seniors. The deadline for the application is Sept. 28, 2019. The final award recipients will be notified by October. 7, 2019 and awards will be presented at the CASPA Annual Conference Dinner Banquet on Saturday Oct. 19, 2019.
Carrying on the tradition of pursuing excellence and community service, the CASPA Student Scholarship is designed to encourage and recognize scholastic and special achievements of the outstanding children of CASPA members. The selection criteria are based on a balanced of academic accomplishments, participation in extracurricular activities, and involvement in community service. Award winners will be invited to attend the 2017 CASPA Annual Banquet to receive the certificate of scholarship and an award check.
All student applicants must meet the following qualifications:
a) The student applicant must be entering senior year in high school at the time of application.
b) At least one parent is a CASPA life-time member for 6-months prior to the application.
Please fill the following application form and send it to Brandon Wang, bwang@CASPA.com, including the following materials on or before September 28, 2019.
1. A copy of high school transcript and SAT1 score report
2. An essay in one of the following two categories with no more than 800 words in MS Word doc:
§ Personal Interests, Accomplishments, and Goals
§ Why should I be awarded the CASPA Student Scholarship?
3. Personal information sheet in MS word doc ( Template in application form )
a. Name of Student Applicant (English & Chinese)
b. Name of High School
c. Parents’ names
d. One photo in passport style (to be published in CASPA Website and Annual Conference Proceedings)
e. A brief summary of honors and awards received, offices of student organizations held, extracurricular activities, community services involved, volunteer work experiences, etc.
Examples of the above materials from previous award winners can be found in www.caspa.com under Scholarship. For more information about CASPA Student Scholarship, please contact Brandon Wang, Committee Chair of CASPA’s Student Scholarship Award via bwang@CASPA.com
2019 CASPA Board of Directors Election Announcement
Dear CASPA members,
Each year, CASPA will elect part of its Board of Directors (BOD) at the annual meeting, according to its By-law. There will be about 10 seats of Directors open to be elected in the upcoming annual conference to be held on Oct. 19, 2019. All eligible candidates are encouraged to apply for these 10 BOD seats, and run for BOD election during the annual meeting. The candidates with the top 10 number of votes will get the 2-year BOD seats, and serve CASPA in a 2 years term.
To be qualified as a candidate for BOD election, you have to be an active individual member with at least six months of membership before the election date.
CASPA has grown stronger and more influential in the US and in Asia, with your membership and continuing support. The success of CASPA depends solely on the unselfish devotion of volunteer members. One opportunity to make a difference to the community and even enhances your professional career is to become a Director of CASPA BOD. It will be a wonderful and memorable personal experience.
You are encouraged to participate in the election. If you are interested and meet the qualification, please email your application with the following info to email@example.com. Please use the title of "2019 CASPA BOD Election" for your email,
1. Your full name,
2. Company name and job title, and
3. Your “significant experiences and areas of contributions in your profession” with no more than 100 words.
Deadline of submitting your application to 2018 BOD election is Sep.27, 2019. Our “BOD election committee” will verify your qualification and get in touch with you after your submission.
CASPA BOD Election Committee
Chinese American Semiconductor Professional Association (CASPA)
Soft Skill Seminar: Interpersonal Skills Fundamentals - EQ & Influence Solution
Date: Wednesday, Aug. 14, 2019
Time: 6:30pm – 9:00pm
Venue: ITRI International Inc., 2870 Zanker Rd #140, San Jose, CA 95134
Interpersonal skills are sometimes called employabilityskills. This shows the importance of interpersonal skills: they’re so crucial that hiring managers really don’t want to hire candidates without them.
Yet, lack of good interpersonal skills is listed as one of the top skills seriously negatively impacting business results!
In this seminar, we will cover the following areas:
1. top interpersonal skills that are important to business winning strategy
2. specifics to improve your EQ and showcase your interpersonal skills before, during and after job interview
3. best practices and trends to leverage influence solution to systematically build sustainable competitive advantages
In such a competitive job market, it’s important to pay extra attention to what interpersonal skills you are conveying to potential employers and how those skills measure up to the requirements of the position.
Once you successfully get a job, you will continue to rely on interpersonal skills. By demonstrating that you are dependable, taking the initiative to lead and having a positive impact on your colleagues, you can develop a strong reputation as a collaborative teammate.
Interpersonal communication skills are increasingly valued by employers in every industry. Regardless of what type of career you are looking to enter, your ability to work well with your colleagues and employer may make a good impression and result in positive career growth.
Leadership development with excellent interpersonal skills is easier! Business profitability with excellent interpersonal skills is easier!! Let's share our ideas and learn together to practice better interpersonal skills
Online registration: Soft Skill Seminar: Interpersonal Skills Fundamentals - EQ & Influence Solution
Law Seminar: How to establish a startup?
Date: Wednesday, Aug. 21, 2019
Time: 6:30pm – 9:00pm
Venue: ITest, Inc. 1905 Tarob Court Milpitas, CA 95035
Speaker 1: Jasmine Ya-Fen Chen
IFor any cross-border enterprise wanting to grow into a multi-billion corporation, it is crucial at its initial start-up phase to properly structure its corporate entities and internal organization. This law seminar is designed to help entrepreneurs and emerging high-tech companies on various key legal issues they would face during the growth of their cross-border enterprises.
This law seminar will cover the following topics:
· Where to incorporate a corporation: U.S. (Delaware; California); British Virgin Islands; Cayman Island; Hong Kong, etc;
· How to choose an entity structure in US (LLC, C-Corp, S-Corp, Partnership)
· Corporate Structure: SPV, Red Chip, VIE (WFOE), etc;
· Various Faucets and Protective Measures in Protecting the Pipeline of your Intellectual Property (Patents, Copyrights, Trademarks, Trade secrets)
Speaker 2:Sunny Wang
This law seminar will discuss financing and stock issues in startup company, and will go through below topics with startup funders, investors and employees:
· What is Convertible Note and how it bridges financings.
· What is preferred stock and how it works in Series A financings.
· What’s the difference between ISO and NSO in startup company stock option plan.
Online registration: Law Seminar: How to establish a startup?
CASPA Special Interest Group Seminar I: Memory and Interfaces for AI and Hyperscale Computing
Date: Wednesday, Aug. 28, 2019
Time: 6:00pm – 9:00pm
Venue: Rambus Inc., 1050 Enterprise Way STE 700 Sunnyvale, CA 94089
6:00 pm Registration opens, networking and food available
7:00 pm Welcome from CASPA
Danny Hua, CASPA President and Chairman of the Board
7:10 pm The Evolving Computing Landscape: How Modern Applications Are Changing the Way We Process Information
Steven Woo, Fellow and Distinguished Inventor, Rambus Labs, Rambus Inc.
7:35 pm High-Performance Interfaces: Choosing the Right Solutions for SoCs
Frank Ferro, Senior Director Product Management, IP Cores, Rambus Inc.
8:00 pm Break
8:10 pm Best Practices for Interface Design Implementation
Arun Vaidyanath, Vice President Engineering, IP Cores, Rambus Inc.
8:35 pm Security Solutions for AI and the Cloud
Neeraj Paliwal, Vice President, Cryptography Products, Rambus Inc.
9:00 pm Closing remarks
9:05 pm Adjourn
Artificial Intelligence has rapidly become the next historically transformative technology, as recent advances in neural networks and the availability of ever more powerful hyperscale computing platforms have broadened AI’s reach and its impact on society. In our increasingly connected world, the needs of data centers, edge computing, and mobile devices are continuing to evolve, and the role of artificial intelligence in each of these locations is evolving as well. But critical challenges remain for enabling higher-performance, more power-efficient, and secure infrastructures supporting AI, all of which offer opportunity for the semiconductor industry. In this seminar, Rambus will discuss some of these challenges, as well as industry directions and potential solutions to support the continued growth of AI and hyperscale computing.
Online registration: CASPA Special Interest Group Seminar I: Memory and Interfaces for AI and Hyperscale Computing
CASPA Special Interest Group Seminar II: From 5,000X Model Compression to 50X Acceleration – Achieving Real-Time Execution of ALL DNNs on Mobile Devices
Date: Wednesday, Sep. 4, 2019
Time: 6:30pm – 9:00pm
Speaker 1:Dr. Yanzhi Wang, Assistant Professor, Northeastern University
This presentation focuses on two recent contributions on model compression and acceleration of deep neural networks (DNNs). The first is a systematic, unified DNN model compression framework based on the powerful optimization tool ADMM (Alternating Direction Methods of Multipliers), which applies to non-structured and various types of structured weight pruning as well as weight quantization technique of DNNs. It achieves unprecedented model compression rates on representative DNNs, consistently outperforming competing methods. When weight pruning and quantization are combined, we achieve up to 4,438X weight storage reduction without accuracy loss, which is two orders of magnitude higher than prior methods. Our most recent results conducted a comprehensive comparison between non-structured and structured weight pruning with quantization in place, and suggest that non-structured weight pruning is not desirable at any hardware platform.
However, using mobile devices as an example, we show that existing model compression techniques, even assisted by ADMM, are still difficult to translate into notable acceleration or real-time execution of DNNs. Therefore, we need to go beyond the existing model compression schemes, and develop novel schemes that are desirable for both algorithm and hardware. Compilers will act as the bridge between algorithm and hardware, maximizing parallelism and hardware performance. We develop a combination of pattern pruning and connectivity pruning, which is desirable at all of theory, algorithm, compiler, and hardware levels. We achieve 20ms inference time of large-scale DNN VGG-16 on smartphone without accuracy loss, which is 50X faster than TensorFlow-Lite. We can potentially enable real-time execution of all DNNs using the proposed framework.
Online registration: CASPA Special Interest Group Seminar II: From 5,000X Model Compression to 50X Acceleration – Achieving Real-Time Execution of ALL DNNs on Mobile Devices
CASPA Autumn Delegation Trip to Taiwan
Date: Sep. 18, 2019 - Sep. 20, 2019
Recruit high tech startups to join 2019 CASPA international Taiwan delegation trip; get the first hand information of Taiwan market, network with high profile VC’s and industry leaders, present your projects in high tech summit, and meet local governmental decision makers. Selected startups will have incentives. Email firstname.lastname@example.org to get registration details and fee information.
Please provide following information:
name/contact, cell phone/email/company, name/presented, project name/bio/projects, introduction (500 words)
(1. core technology; 2 projected revenue; 3. land/facility/fund requirements 4. require roadshow)