Job Responsibilities:
- Responsible for the design and simulation of analog and mixed signal circuits.
- Circuits include but are not limited to IO, Bandgap, OSC, ADC, DAC, Laser Driver, LA, TIA, CDR, etc.
- Responsible for communicating with the layout engineer and guiding the layout engineer to complete the circuit layout design.
- Develop a test plan for the chip, and cooperate with the chip test after the film is taped out.
- Responsible for writing related design documents in the chip design process.
Job Requirements:
- Microelectronics, electronic engineering related majors, master’s degree more than 3 years, bachelor’s degree more than 5 years’experience in analog circuit design.
- Familiar with analog IC circuit design methods, have a relatively in-depth understanding of semiconductor devices and process flow, and be familiar with CMOS and SIGE processes.
- Familiar with analog circuit-level design tools such as Cadence or Synopsys.
- Have good teamwork skills, communication skills, learning skills and problem analysis and processing skills, and complete the set goals with members of the R&D team.
- Have good English reading skills.
- Experience in mass production of multiple ICs, development experience in ADC, DAC, PLL, Serdes is preferred.
To apply for this job email your details to caspa@caspa.com