Jobfair2023 TSMC

Jobs BY work location

San Jose, CA,  San Diego, CA and Austin, TX

CASPA 2023 Job Fair Attendees: Please click “Apply” to submit your online application. Our recruiter will review and reach out to you for more information.

Design and R&D Positions:

• Physical Design Engineer – Analog Power Management
• Design Senior Engineer
• Technical Manager – Physical Design
• Technical Manager – IC Layout Design
• Technical Manager – Quality & Reliability
• R&D Principal Engineer – Atomistic & Device Simulation
• Principal Engineer – Scientific Computing

Basic Qualifications:

• Master/ Doctorate Degree (Doctorate is strongly preferred for R&D positions)
• Physics, Applied Physics, Applied Mathematics, Materials Science and Engineering, Chemistry, Chemical Engineering, Electrical Engineering, or related disciplines

Project and Account Management Positions (Technical):

• Project Manager – 3DFabric
• Project Manager – IP/ Design/ Process Technology
• Account Manager

Basic Qualifications:

• Bachelor/ Master’s Degree in Electrical Engineering, Computer Science, or similar engineering disciplines

Phoenix, AZ

Job title: 2023 CASPA Job Fair_AZ
Content:
At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. As long as you have the same passion to pursue excellence, you will find your fit here.

TSMC Arizona is looking for talents to join our 5-nanometer fab, located in sunny Phoenix. You will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust.
CASPA 2023 Job Fair Attendees: Please submit online application through THIS LINK. Our recruiters will review your application and reach
out to you for more information.

 Manager Positions:

• Diffusion Module Engineering Manger
• Process Integration Engineering Manager

Engineering Positions:

•  Module Process Engineer (PE)
•  Module Equipment Engineer (EE)
•  Process Integration Engineer (PIE)
•  Yield Enhancement Engineer (YED)
•  Intelligent Manufacturing Engineer (MFG)
•  Advanced Material Handling System Integration Engineer (AMHS)
•  Computer Integrated Manufacturing Engineer (CIM)
•  E-Beam Engineer (EBO)
• Material Engineer

Work Location: Phoenix, AZ

Taiwan(Hsinchu)

At TSMC, We Develop the Technologies that Shape the Future and Change the World!

CASPA 2023 Job Fair Attendees: Please submit online application through THIS LINK. Our recruiters will review your application and reach out to you for more information. 

The open roles for you

• R&D Engineer (Device, Integration, Module)
• Pathfinding for System Integration Engineer
• Physical Design Engineer
• More than Moore R&D Process Integration Engineer

For detailed job description, please refer to Link

Basic Qualifications

•  Master/Ph.D. degree in Electronics, Electrical Engineering, Mechanical, Material Science, Chemical Engineering and related fields. (Ph.D. is preferred for R&D positions)
• Good problem–solving and communication skills as well as a willingness to learn.
• A team player who can multitask and thrive in a very dynamic and fast-paced environment.

Company Description:

At TSMC, We Develop the Technologies that Shape the Future and Change the World!

Technology is our cornerstone, and Innovation is our passion. At TSMC, we bring together the most creative minds in science and technology to provide the best foundry services possible, and drive innovation in fields that revolutionize our world and daily lives including high performance computing, mobile, automotive electronics, and the Internet of Things.

If you want to challenge yourself and unleash innovation with brilliant colleagues located around the world, come join us!

As a trusted technology and capacity provider, TSMC is driven by the desire to be:

• The world’s leading dedicated semiconductor foundry
• The technology leader with a strong reputation for manufacturing excellence
• Advancing semiconductor manufacturing innovations to enable the future of technology

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and a portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

Diversity Statement:

TSMC is committed to employing a diverse workforce and provides Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, or any other characteristic protected by applicable law.