CASPA 2020 Spring Online Workshop: Semiconductor Investment and Technology Trends under COVID-19 Pandemic

Bio: Chen Xiaoxiao is an enthusiastic, low-key and visionary entrepreneur with a long record of success. Xiaoxiao graduated from China University of Political Science and Law in 1999 with a Master Degree in Law. She worked in the Office of Xuanwu District Government Management Committee from 1999 to 2000; from 2000 to 2002, She worked for Macromedia Software Development Company in the United States, and held marketing positions in China. From August 2002 to June 2008, he served as the website operation director of Beijing Iridian Puhui Technology Co., Ltd., and later served as deputy general manager. In April 2002, she started her own business in the commodity market, serving as the Chairman for Zepu County Fuqiang Cotton Industry Co., Ltd. In 2009, she started her second company, China-Canada Cotton Industry Co., Ltd, and the company later expanded into Jiashi, Shache and Luntai counties. In 2013, she founded Guizhou Fuqiang Construction Engineering Co., Ltd. and invested in the Sandu Aquarium Cultural Customs Valley Poverty Alleviation and Ecological Migration Project. In February 2019, she founded Asian Chip Semiconductor Materials Co., Ltd. as the Chairman and CEO.

Asian Chip, headquartered in Changzhou, China, is the industry leader in high purity target materials. Its cutting-edge technology originates from 10-year R&D led by Academician Cai Hongnian and Professor Tan Chengwen of Beijing Institute of Technology. Asian Chip’s high-purity refractory metal targets for sputtering coating in semiconductor chip manufacturing are special and high value-added semiconductor materials with billions of dollars in market size. Asian Chip’s advanced manufacturing overturns the traditional powder metallurgy process and produces tungsten target with high purity (8N, 99.999999%), high-density (99.9% of theoretical density), uniform microstructure of material, and diameters of 360mm (8 inches) and 450mm (12 inches).

Abstract: The target market has historically been monopolized by foreign companies, with Japan and the United States occupying about 80% of the domestic market share. Sputtering target producers represented by multinational groups such as Honeywell (USA), Nippon Metals (Japan), Tosoh (Japan), etc. entered the field earlier. The technical force, fine production control and excellent product quality occupy the leading position in the global sputtering target market. With the transfer of downstream industries to China, domestic targets have begun to achieve breakthroughs. At present, semiconductor aluminum targets and molybdenum targets have achieved large-scale supply, copper targets in 18-19 are expected to break through, and ITO targets have begun to be supplied in small quantities in 18. A few domestic companies have cut into mainstream customer supply systems, such as Jiangfeng’s small batch supply at TSMC and Global Foundry; Yanyi Gold Cu targets have been sold in batches at SMIC and Huali; Longhua and Ashithuang etc. Display giants such as BOE. The global target market is expected to exceed 100 billion yuan in 2020. In 2016, the global sputtering target market capacity reached US $ 11.36 billion, an increase of 20% compared to US $ 9.48 billion in 2015. WSTS predicts that the average compound growth rate for 2017-2019 will be 13%. From this, it is estimated that the global high-purity sputtering target market size in 2019 will be approximately RMB 111.1 billion (US $ 16.3 billion). It is expected that the growth of sputtering targets in the future will be driven mainly by the downstream demand for high growth rates such as displays and semiconductors; and with the downstream application requirements for device interconnection and conductivity, and the requirements for miniaturization and precision, the thickness of sputter coatings is small , Can be accurately controlled, unit usage is expected to gradually increase.