CASPA Singapore Delegation 2023 team visited Singapore on September 18 – 20, 2023.
During the trip, we visited the Singapore EDB (Economy and Development Bureau). We learnt that the Singapore government has focused on growing the semiconductor industry in recent years and has achieved great success. For example, UMC plans to invest USD $4.8B on a wafer fab facility from the year 2022. There are other multiple companies investing in Singapore now.
We also attended the SSIA (Singapore Semiconductor Industry Association) Dinner Banquet. It is the most significant event in the Singapore semiconductor industry. [SSIA – https://ssia.org.sg]
In addition, we also visited the Singapore office of Canaan Creative company (Listed on Nasdaq as CAN), the startup incubator office at National University of Singapore (NUS) and a GaN device technology seminar hosted at NUS.
The delegation head was Dr. Tony Xia, CASPA Chairman and President. The lead was Dr. Gary Wang, CASPA BOD and sponsorship team lead, organized the whole trip and recruited the delegation team. Dr. Rechard Yang from CASPA Singapore chapter helped to arrange the local events. The team members included representatives from 5 different companies.
