CASPA 2025 Summer Career Fair summary
The event was led by Chengshen Wang,Head of Career Fair and Keming Bi, Head of IT, Co-head of Career Fair with tremendous support from a dedicated operations and planning team:
Julie Zhang, Kathy Tian, Steve Jiang, Tairan Zhu, Shanwei Shi, Iris Song, Gabriela Yin, Simon Tan, Linda Zhao, Yolanda Zhang, Jaxen Tang, Bing Su, Rainman Rui, Yan Jiao, Mengchi Xie, Derek Dou, Qinghua Zhao, Vicky Chen, Yuchen Cai, Oswald Wang, and Ruipeng Ge.
On June 14th,2025, the Chinese American Semiconductor Professional Association (CASPA) successfully hosted its 2025 Summer Career Fair at our all-hands venue. The event drew an enthusiastic crowd of over 200 attendees, including recent graduates, early-career engineers, and seasoned industry professionals.
🎤 Featured Speakers & Program Highlights:
- Opening Remarks: Zhibin Xiao, CASPA President
- Industry Keynotes:
- Judie Chiu, Head of HR, from TSMC N.A.
- Timothy Lee, President of IEEE-USA
- Robert Wachen, COO of Etched.ai
- Ian Chen , Chief of Revenue Officer of Sivaco
- Jeffrey Chan, General Manager, GUC N.A.
- Panel Discussion: “AI: The Second Half” – a deep dive into how the AI market may shift as we move beyond halftime. We welcomed speakers from GUC and others, with an open invitation extended to Etched.ai’s Head of Strategic Finance, Tim Perevozchikov to moderate.
🚀 Participating Companies:
The event featured 10 company booths, with space for up to 20. Confirmed participants included:
- TSMC, GUC, Alchip, Solidigm, Futurewei, Silvaco, Sytron, ASE
- Startups such as Etched.ai, Heron Power
- Alliance partners like IEEE
Invitations were also extended to prominent industry players like AMD, Meta, ByteDance, Broadcom, Marvell, Coherent, ARM, and Advantest.
🎯 Impact:
The CASPA 2025 Career Fair served as a dynamic platform that bridged talent and opportunity across the semiconductor and AI sectors. With robust turnout and active participation from both companies and job seekers, the event highlighted CASPA’s pivotal role in driving career advancement, industry collaboration, and technological innovation. From high-impact networking to meaningful recruiting conversations, the fair reaffirmed our mission to empower the next generation of innovators.
Value:
This was not just another career fair—it was a highly curated, in-person recruiting event featuring verified job openings and direct engagement with both hiring managers and HR professionals. With deep commitment from participating companies, many brought cross-functional teams on-site to connect face-to-face with candidates. Beyond resume drops, CASPA facilitated thoughtful discussions with company executives in a dedicated screening room, creating an integrated experience that combined professional networking, industry insights, and future-oriented career conversations. For the semiconductor sector, such depth, sincerity, and efficiency in one event are truly rare.
Sponsors and hiring companies:
- At the booth sponsored by Etched AI, a pioneering AI chip startup, the event venue was graciously supported by their team. Etched AI “burns the transformer architecture into its chips to build the world’s most powerful servers for transformer inference.”
- TSMC, the world’s largest dedicated semiconductor foundry, powers innovation globally. Judie Chiu, Head of HR North America, shared insights on talent strategy. Their HR and hiring managers warmly engaged attendees with career advice and swag.
- Silvaco, a global TCAD, EDA, and SIP software provider, was represented by Ian Chen, Chief Revenue Officer and featured speaker. Their team offered attendees career insights and EDA opportunities.
- GUC (Global Unichip Corporation), a leader in ASIC and SoC design, was represented by Jeffrey Chan, GM of North America. Their team provided a welcoming space for career discussions and idea exchange.
- Sytron, a Singapore-based chemical solutions firm, was represented by Jeffrey Chan, GM North America. Their sponsorship added valuable industry presence to the event.
- IEEE, the world’s largest technical professional organization, partnered with CASPA 2025. Timothy Lee, President of IEEE-USA, delivered a keynote. Their booth offered networking and professional development resources.
- ASE Technology Holding Co., Ltd., the world’s largest OSAT provider, supported the event as an exhibitor, highlighting leadership in packaging and testing services.
- Futurewei Technologies, an ICT research firm, joined as exhibitor and sponsor. Their experts engaged attendees on innovation in wireless, networking, and open ecosystems.
- Heron Power, a startup in solid-state transformers, sponsored the event and conducted on-site interviews, offering deep energy tech insights.
- AIChip, an AI semiconductor innovator, engaged job seekers with thoughtful conversations at their booth.
- Solidigm, a NAND flash leader, provided a dedicated application portal. Volunteers assisted attendees through the on-site process.