CASPA eLetter Issue 237 – Dec 31, 2022

Dear CASPA members, sponsors, and advocates,

Thank you for your generous support! We hope this email finds you safe and healthy, and wish you and your family a joyous holiday season!

The year 2022 has been challenging for the semiconductor industry due to the pandemic, war, and disruption of supply chains. CASPA has worked proactively to help the semiconductor community promote sponsors’ technology endeavors, and keep our members staying in touch with the latest technology innovations. Our various seminars on topics of power IC, packaging and chiplets, Spring Symposium entitled “Mega Trends on Semiconductor Ecosystem”, Summer Symposium entitled “Extending Moore’s Law for New Breed of Semiconductors” had gained a lot of attractions and positive feedback. Furthermore, during the Annual Conference and Dinner Banquet, more than a thousand of CASPA members and sponsors attended the event online or in person, where Rene Hass, the CEO of ARM, delivered a keynote speech “Our Cyclical Industry” , and more than ten industry experts talked about the exciting innovations on “Computing, Connectivity and Storage”.

Looking forward to 2023, CASPA will continue to serve the local community through its signature events: Spring and Summer Symposiums, Job fair, Science and Engineering Fair and Annual Conference. In addition, CASPA plans to hold a series of seminars to help our members achieve their career goals. In our coming signature event, 2023 Spring Symposium, we plan to invite speakers to discuss the latest breakthroughs in the automotive segment such as autonomous driving, AI edge computing, safety and security, etc… Please stay tuned for our latest announcements.

Merry Christmas and Happy New Year!

CASPA 2022-2023 Leadership Team