President’s Words
Dear CASPA members
Whole world has suffered from Coronavirus for almost 2 years. We appreciate the medical worker’s hard work. If you have friends and family who work as nurses or doctors, please bring our appreciation for them.
Pandemic causes a lot of inconvenience for our work and life, but it does bring us a lot of new opportunities. Here I list a couple: mRNA related biology technology vaccines save our lives. Cloud based digital transformation enables us to work, meet and social remotely. AR/VR/AI and Electrical Vehicle have gone deeper in our society, enabling us to live and transport more conveniently and efficiently.
Semiconductor devices are the Key enablement for all this technology, Server, PC, mobile, sensor, charger, automotive, machine are all based on it. chip shortage makes everybody aware of it. We cannot live without them. Pandemic speeds up the digital transformations dramatically, This brings us the semiconductor renaissance, CASPA are proud to be part of it.
I am glad that CASPA has shown strong resilience during this pandemic. We have transferred our symposium, seminar, job fair, science fair online successfully, and brought more speakers, participants and audiences. Because of our volunteer’s excellent contribution, The CASPA 2021 BOD group has won the President’s Volunteer Service Award. At the same time ,I would like to send special thanks for our existing 62 Sponsors and 10 alliances’ great support as well.
CASPA as an association not only helps in business and career, but also builds friendship, and brings more fun and useful info for our life, our members help each other during the pandemic, we host hiking events, new year galas online for entertainment and team building
We will carry on all this good stuff into 2022, bring value for our sponsors, members and volunteers. With your support, we are looking forward to another fruitful new year.
Haohua Zhou
President and Chairman, CASPA
CASPA Events
Semiconductor News
Date | Title (Chinese) | Title (English) |
01/28/2022 | 2022年的电子产业:五大趋势预测 | Five predictions for the electronics industry in 2022 |
01/28/2022 | WiFi 7的野心 | What can WiFi 7 provide? |
01/28/2022 | 新一轮EUV光刻机争夺战开打 | A new round of EUV lithography machine competition |
01/28/2022 | 围攻SiC衬底龙头 | The rising competition for SiC substrate |
01/28/2022 | 元宇宙背后的芯片机会 | The opportunities for chip behind Metaverse |
01/28/2022 | 汽车大变局下的Tier1供应商 | Tier1 automobile suppliers in the great changes |
01/28/2022 | 成熟制程闹翻天 | Mature process technology in short of capacity |
01/28/2022 | 热度不减的氮化镓 | GaN: still hot |
Alliance Events
- [IEEE] IEEE San Francisco Events
CASPA Job Alert
- [Broadcom] is looking for IC CAD ENGINEER, HARDWARE ENGINEER
- [ASE (U. S.) INC.] is looking for Sales Manager , Technical Program Manager, Sr. Application Engineer, Engineer/Sr. Engineer, Account Manager
- [Proteantecs] is looking for Post-silicon application engineer/manager, Sales operations specialist/leader, Pre-silicon Application Engineer
- [AllWin21] is looking for Semiconductor Equipment Engineer
SUMMARY OF PAST CASPA MAJOR EVENTS
- The following links include presentation materials and/or summary for previous major CASPA events in the recent year:
Sponsor Events/News
- New Lease Opportunity for Two Building Office R&D with 4800SF Class 10K Cleanroom. Please Contact [email protected] for details.