Challenges & Innovations of Power Management Solutions for Data Center & AI

• The power semiconductor market is experiencing a notable upswing, propelled by the emergence of cutting-edge technologies spanning power devices to power management ICs. The widespread adoption of power semiconductors is evident in burgeoning market verticals such as compact consumer electronics, 5G communication, Data Centers, Automotive, particularly the rapidly expanding Electric Vehicles segment, and more.
• In this dynamic digital landscape, there is an escalating demand for high-bandwidth access to extensive data computation, storage, and networking, predominantly facilitated by state-of-the-art data centers. Applications like artificial intelligence, machine learning, content streaming, and cloud-based services are propelling the rapid growth of hyperscale data centers. Designing power management solutions for data centers that prioritize high efficiency, power density, and reliability is becoming increasingly challenging.
• Seizing this pivotal moment for power semiconductors, CASPA, the largest Chinese American semiconductor professional association worldwide, is committed to fostering technological innovation within the high-tech community. To this end, CASPA is organizing the 2024 Winter Symposium, dedicated to exploring the challenges and innovations in power management solutions for data centers.

Date and time

Speaker lineup

Rob Chacchia,

President of Richtek North America

Rob Chiacchia has worked in the power semiconductor industry for more than 35 years, as design director and general product line manager for major semiconductor IC companies such as Analog Devices, Linear Technology. He is currently the president of Richtek North America and leading the Richtek’s business development and growth in US.

Ray Pang

VP, Technology & Business Enablement, Supermicro

Ray Pang is the VP, Technology & Business Enablement at Supermicro. Previously Ray Pang was the Sr. Director Product Management and Marketing at Primary Data Inc.

George Feng

George Feng is a lead principal application engineer in Infineon Technologies, with responsibilities of new product definition in POL products and technical interface with Google cloud power.

Before that, he held system/application engineer and manager roles across Empower Semiconductor, ON Semiconductor and Analog Devices, working on the definition, development, and application of various DC/DC power management solutions in multi-phase VRs, POLs, IVR and e-fuse.

GaoLing Zou

Gaoling Zou, holding academic achievements from Shanghai Jiaotong University and the University of Toronto, boasts over two decades of industry expertise in power management applications, power system design, and product definition and marketing. With a consistent track record of leadership and innovation in the semiconductor industry, Gaoling Zou presently holds the position of Senior Director of Communication and Cloud Infrastructure Power at Analog Devices.

ShanShan Yang